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VLSI CALENDAR/2027/INDUSTRY & ACADEMIA

2027-03-30 — 2027-04-01 · CROSS-CHECKED

Industry & academia

Chiplet Summit 2027

Conference organized by Chiplet Summit, focused on Advanced Packaging, Design / EDA, AI / HPC.

OFFICIAL PAGE ↗GOOGLE CALENDAR ＋APPLE / .ICS ↓WEEKLY EVENT BRIEFING ↗DEADLINE & CHANGE ALERT ↓
VLSI Korea semiconductor observatory artwork used as an editorial topic image
RELATED EDITORIAL IMAGE · NOT THE EVENTVLSI Korea · VLSI Korea owned editorial artwork · CREDIT ↗
STRUCTURED RECORDchiplet-summit-2027schema 1.0 · series chiplet-summit · edition 2027
DATE
2027-03-30 — 2027-04-01
TIME
All-day · detailed time not announced
TIME ZONE
America/Los_Angeles
Pacific Time · location derived
LOCATION
Santa Clara, CA · United States
FORMAT
In person · Conference
CATEGORY
Industry & academia
ORGANIZER
Chiplet Summit
TOPICS
Advanced Packaging · Design / EDA · AI / HPC
VERIFICATION
CROSS-CHECKED · industry calendar · 2026-08-19
NEXT REVIEW
2026-09-18
COVERAGE
core
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01Attend / register

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02Programme, brochure & results

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Prior-edition articles and result reports are linked in the archive below once their source is verified.

03Series profile & record stats
Cadence
Cadence not yet verified
First held
Not yet verified
Edition
Edition number not verified
Record series
chiplet-summit
3Event days
3Verified sources
0Listed sessions
2Linked materials
These figures describe record coverage—duration, sources, sessions and materials—not attendee or exhibitor totals.
04Core topics & focus

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Advanced PackagingDesign / EDAAI / HPC
05Visit the venue

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CONTEXT & HISTORY

Previous editions and VLSI Korea coverage

Verified previous editions, official proceedings, attendee guides, recaps and technical deep dives are linked here.

FULL SERIES HISTORY ↗
EDITION · 2026Chiplet Summit 2026↗
PROVENANCE

Field-level source ledger

cross checked · last checked 2026-08-19
PRIMARY · official eventChiplet Summit · official event page

identity · organizer

Retrieved 2026-08-19 ↗SECONDARY · industry calendarSemiconductor Engineering

identity · dates

Retrieved 2026-08-19 ↗SECONDARY · editorialVLSI Korea · image source

media

Retrieved 2026-08-19 ↗
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SIMILAR BY RECORD
2027-03-20 · INDUSTRY & ACADEMIAIEEE HPCA 2027SHARED · AI / HPC · Design / EDA ↗2026-03-16 · COMPANY TECHNOLOGYNVIDIA GTC 2026SHARED · AI / HPC · Design / EDA ↗2027-03-30 · INDUSTRY & ACADEMIAACM International Symposium on Physical Design 2027SHARED · Design / EDA · AI / HPC ↗2026-09-08 · COMPANY TECHNOLOGYSNUG Korea @ Synopsys Converge 2026SHARED · Design / EDA · AI / HPC ↗
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