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VLSI CALENDAR/2026/INDUSTRY & ACADEMIA

2026-03-01 — 2026-03-04 · PAST EDITION

Industry & academia

IEEE EDTM 2026

Conference organized by IEEE Electron Devices Society, focused on Manufacturing, Materials, Advanced Packaging.

Registration

This edition has ended. Explore the archive and future editions.

2026-03-01 → 2026-03-04 · Setia SPICE Convention Centre

Early-bird deadline
Not published
Registration deadline
Not published
Check the organizer’s website ↗
WHEN2026-03-01 — 2026-03-04All-day · time not announced
WHERESetia SPICE Convention Centre · Penang · MalaysiaIn person · Conference
FOCUSManufacturing · Materials · Advanced PackagingIEEE Electron Devices Society
TRUSTOFFICIAL SOURCE2 sources · 2026-08-19
EVENT BRIEFING

What to know before IEEE EDTM 2026

A decision-ready event record: confirmed logistics, attendance path, programme status and a traceable source trail.

EVENT OVERVIEW

IEEE EDTM 2026 is a in person conference organized by IEEE Electron Devices Society. This guide separates confirmed event facts from details the organizer has not yet published, so a visitor can make a practical attendance decision without treating a calendar listing as a promise.

This edition is listed for 2026-03-01–2026-03-04 in Setia SPICE Convention Centre, Penang, Malaysia. The record is organized around Manufacturing, Materials, Advanced Packaging; use the official materials for the final programme, speaker line-up and any last-minute venue or registration changes.

FAQ

Event information FAQ

When is IEEE EDTM 2026?
2026-03-01–2026-03-04. The organizer has not published a time in this record.
Where is IEEE EDTM 2026?
It is listed for Setia SPICE Convention Centre, Penang, Malaysia. Recheck the official guide and the map link below for the exact venue scope.
How do I register or attend?
A direct registration URL has not been officially verified in this record. Use the organizer’s page for the latest attendance instructions.
What does the event cover?
The record’s main searchable topics are Manufacturing, Materials, Advanced Packaging. Use organizer-published materials for the detailed agenda.
How current is this information?
This page preserves 2 sources, including IEEE Electron Devices Society · official event page, and was last reviewed on 2026-08-19. Recheck the official page before booking.
Semiconductor cleanroom used as an editorial topic image
RELATED EDITORIAL IMAGE · NOT THE EVENTNASA Glenn Research Center · Public domain · CREDIT ↗
STRUCTURED RECORDedtm-2026schema 1.0 · series edtm · edition 2026
DATE
2026-03-01 — 2026-03-04
TIME
All-day · detailed time not announced
TIME ZONE
Asia/Kuala_Lumpur
Malaysia Time · location derived
LOCATION
Setia SPICE Convention Centre · Penang · Malaysia
FORMAT
In person · Conference
CATEGORY
Industry & academia
ORGANIZER
IEEE Electron Devices Society
TOPICS
Manufacturing · Materials · Advanced Packaging
VERIFICATION
OFFICIAL SOURCE · official association · 2026-08-19
NEXT REVIEW
2027-02-15
COVERAGE
core
ATTENDEE INTELLIGENCE

Plan this event

Registration, travel, official materials and prior results in one record. We link verified resources only and never invent unpublished details.

01Attend / register

This edition has ended. Use the organizer’s page for the next edition and any published results.

Status: Check official status
02Programme, brochure & results

A programme or brochure appears here only after the organizer publishes an official source.

Prior-edition articles and result reports are linked in the archive below once their source is verified.

03Series profile & record stats
Cadence
Cadence not yet verified
First held
Not yet verified
Edition
Edition number not verified
Record series
edtm
4Event days
2Verified sources
0Listed sessions
2Linked materials
These figures describe record coverage—duration, sources, sessions and materials—not attendee or exhibitor totals.
04Core topics & focus

These tags are searchable focus areas from the event record and VLSI Calendar taxonomy.

ManufacturingMaterialsAdvanced Packaging
CONTEXT & HISTORY

Previous editions and VLSI Korea coverage

Verified previous editions, official proceedings, attendee guides, recaps and technical deep dives are linked here.

FULL SERIES HISTORY ↗
PROVENANCE

Field-level source ledger

official confirmed · last checked 2026-08-19
PERSONAL SIGNAL

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Lead time
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COMMUNITY SIGNAL

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