- DATE
- 2026-05-26 — 2026-05-29
- LOCATION
- Orlando, FL · United States
- FORMAT
- In person · Conference
- ORGANIZER
- IEEE Electronics Packaging Society
- TOPICS
- Advanced Packaging · Test / Reliability · Materials · AI / HPC
- VERIFIED
- IEEE EPS official · 2026-08-07
2026-05-26 — 2026-05-29 · PAST EDITION
IEEE ITherm 2026
Conference organized by IEEE Electronics Packaging Society, focused on Advanced Packaging, Test / Reliability, Materials, AI / HPC.
COMMUNITY SIGNAL
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