VLSI CALENDARBY VLSI KOREATECHNOLOGY EVENT INDEX
ADVANCED PACKAGING Semiconductor Events Calendar
Browse curated upcoming and past ADVANCED PACKAGING semiconductor conferences, exhibitions and company events, with links to source pages.
- ALL EVENTS
- 56
- UPCOMING
- 34
- PAST
- 22
- COUNTRIES
- 13
How to use the ADVANCED PACKAGING event index
Use this source-linked index to compare dates, locations and formats, then save or export the events relevant to your work.
Upcoming events
Source-linked · nearest dates first
Forum organized by imec, focused on Manufacturing, AI / HPC, Photonics.
Expo organized by SEMI Taiwan, focused on Manufacturing, Advanced Packaging, AI / HPC.
Conference organized by Synopsys, focused on Design / EDA, AI / HPC, Advanced Packaging.
Conference organized by IEEE EPS, focused on Advanced Packaging, Test / Reliability, Manufacturing.
Conference organized by AI Infra, focused on AI / HPC, Memory, Advanced Packaging.
Conference organized by THERMINIC, focused on Test / Reliability, Advanced Packaging, Manufacturing.
Forum organized by TSMC, focused on Design / EDA, Manufacturing, Advanced Packaging.
Conference organized by IMAPS, focused on Advanced Packaging, Manufacturing.
Conference organized by IEEE, focused on Advanced Packaging, Design / EDA.
Conference organized by Synopsys, focused on Design / EDA, Verification, Advanced Packaging.
Forum organized by Applied Materials, focused on Manufacturing, Materials, Advanced Packaging.
Expo organized by SEMI Americas, focused on Manufacturing, Business, Advanced Packaging.
Expo organized by Korea Semiconductor Industry Association, focused on Manufacturing, Materials, Equipment.
Conference organized by IEEE, focused on Advanced Packaging, Design / EDA.
Conference organized by PIC Summit Europe, focused on Photonics, Advanced Packaging.
Conference organized by IEEE CEDA, focused on Design / EDA, Test / Reliability, Verification.
Conference organized by Siemens EDA, focused on Design / EDA, Advanced Packaging, Verification.
Forum organized by TSMC, focused on Design / EDA, Manufacturing, Advanced Packaging.
Forum organized by TSMC, focused on Design / EDA, Manufacturing, Advanced Packaging.
Forum organized by TSMC, focused on Design / EDA, Automotive, Advanced Packaging.
Conference organized by IEEE Computer Society, focused on Test / Reliability, Verification, Hardware Security.
Conference organized by IEEE Electronics Packaging Society, focused on Advanced Packaging, Manufacturing, Materials.
Conference organized by IEEE Electronics Packaging Society, focused on Advanced Packaging, Design / EDA, Test / Reliability.
Expo organized by SEMI Korea, focused on Manufacturing, Memory, Advanced Packaging.
Conference organized by IEEE Power Electronics Society, focused on Power, Advanced Packaging, Materials.
Conference organized by IEEE Electron Devices Society, focused on Manufacturing, Materials, Advanced Packaging.
Conference organized by NVIDIA, focused on AI / HPC, Advanced Packaging, Memory.
Conference organized by IEEE Computer Society, focused on AI / HPC, Design / EDA, Memory.
Conference organized by IEEE Reliability Society, focused on Test / Reliability, Manufacturing, Materials.
Conference organized by Chiplet Summit, focused on Advanced Packaging, Design / EDA, AI / HPC.
Expo organized by SEMI Americas, focused on Manufacturing, Business, Advanced Packaging.
Conference organized by ACM SIGDA / IEEE CEDA, focused on Design / EDA, AI / HPC, Advanced Packaging.
Conference organized by IEEE Microwave Theory and Technology Society, focused on Wireless, Design / EDA, Test / Reliability.
Conference organized by IEEE Electronics Packaging Society, focused on Advanced Packaging, Manufacturing, Materials.
Past events
An archive for comparing previous editions
Conference organized by Synopsys, focused on Design / EDA, AI / HPC, Advanced Packaging.
Conference organized by FMS / Terrapinn, focused on Memory, AI / HPC, Advanced Packaging.
Forum organized by SEMI Korea, focused on Advanced Packaging, Manufacturing, Materials.
Conference organized by SEMI Americas, focused on Materials, Manufacturing, Equipment.
Training organized by Applied Materials, focused on Memory, Advanced Packaging, Materials.
Conference organized by SEMI Europe, focused on Advanced Packaging, Manufacturing, Materials.
Conference organized by IEEE Electron Devices Society, focused on Manufacturing, Materials, Advanced Packaging.
Conference organized by NVIDIA, focused on AI / HPC, Advanced Packaging, Networking.
Conference organized by IEEE Electronics Packaging Society, focused on Advanced Packaging, Manufacturing, Materials.
Conference organized by IEEE Electronics Packaging Society, focused on Advanced Packaging, Test / Reliability, Materials.
Forum organized by imec, focused on Manufacturing, AI / HPC, Materials.
Conference organized by SEMI, focused on Manufacturing, Materials, Equipment.
Conference organized by Siemens EDA, focused on Design / EDA, Advanced Packaging, Verification.
Conference organized by IEEE Test Technology Technical Council, focused on Test / Reliability, Hardware Security, Advanced Packaging.
Forum organized by TSMC, focused on Manufacturing, Advanced Packaging, AI / HPC.
Conference organized by IEEE Reliability Society, focused on Test / Reliability, Manufacturing, Materials.
Expo organized by SK hynix, focused on Memory, AI / HPC, Advanced Packaging.
Conference organized by NVIDIA, focused on AI / HPC, Design / EDA, Advanced Packaging.
Conference organized by ACM SIGDA / IEEE CEDA, focused on Design / EDA, AI / HPC, Advanced Packaging.
Conference organized by Synopsys, focused on Design / EDA, Verification, Advanced Packaging.
Conference organized by IEEE Electron Devices Society, focused on Manufacturing, Materials, Advanced Packaging.
Conference organized by Chiplet Summit, focused on Advanced Packaging, Design / EDA, AI / HPC.
Semiconductor insight beyond the event dates
Read industry news, technical analysis and ecosystem shifts at VLSI Korea.