VLSI CALENDARBY VLSI KOREATECHNOLOGY EVENT INDEX
DESIGN · EDA Semiconductor Events Calendar
Browse curated upcoming and past DESIGN · EDA semiconductor conferences, exhibitions and company events, with links to source pages.
- ALL EVENTS
- 116
- UPCOMING
- 85
- PAST
- 31
- COUNTRIES
- 27
How to use the DESIGN · EDA event index
Use this source-linked index to compare dates, locations and formats, then save or export the events relevant to your work.
Upcoming events
Source-linked · nearest dates first
Conference organized by IEEE, focused on AI / HPC, Design / EDA.
Expo organized by World Robot Conference, focused on Edge AI, Automotive, Design / EDA.
Forum organized by AMD, focused on AI / HPC, Automotive, Design / EDA.
Conference organized by IEEE TCMM, focused on AI / HPC, Memory, Design / EDA.
Conference organized by Brazilian Computer Society / IEEE CEDA, focused on Design / EDA, Embedded, AI / HPC.
Forum organized by AMD, focused on AI / HPC, Automotive, Design / EDA.
Conference organized by Synopsys, focused on Design / EDA, IP, Verification.
Training organized by Texas Instruments, focused on Power, Design / EDA.
Forum organized by Synopsys, focused on Design / EDA, IP, AI / HPC.
Forum organized by AMD, focused on AI / HPC, Automotive, Design / EDA.
Conference organized by Synopsys, focused on Design / EDA, Verification, IP.
Training organized by Cadence, focused on Design / EDA, Business.
Conference organized by ACM / IEEE, focused on Design / EDA, AI / HPC.
Conference organized by IEEE, focused on Design / EDA, Manufacturing, AI / HPC.
Conference organized by Synopsys, focused on Design / EDA, AI / HPC, Advanced Packaging.
Forum organized by SEMI, focused on AI / HPC, Design / EDA.
Forum organized by Arm, focused on Edge AI, AI / HPC, Design / EDA.
Forum organized by ESD Alliance / SEMI, focused on Design / EDA, Hardware Security, AI / HPC.
Training organized by Cadence, focused on Design / EDA, Automotive.
Forum organized by Arm, focused on Edge AI, AI / HPC, Design / EDA.
Conference organized by FMCAD Inc. / IEEE CEDA, focused on Verification, Design / EDA, Hardware Security.
Training organized by Texas Instruments, focused on Analog, Power, Design / EDA.
Training organized by Infineon, focused on Power, Design / EDA.
Forum organized by TSMC, focused on Design / EDA, Manufacturing, Advanced Packaging.
Conference organized by IEEE Electron Devices Society, focused on Design / EDA, Manufacturing, Materials.
Conference organized by Microelectronics UK, focused on Business, Design / EDA.
Forum organized by AMD, focused on AI / HPC, Automotive, Design / EDA.
Conference organized by IEEE, focused on Advanced Packaging, Design / EDA.
Forum organized by AMD, focused on AI / HPC, Automotive, Design / EDA.
Conference organized by ACM / IEEE, focused on Embedded, Design / EDA, AI / HPC.
Training organized by STMicroelectronics / Biricha, focused on Power, Design / EDA, Embedded.
Forum organized by Synopsys, focused on Design / EDA, IP, AI / HPC.
Forum organized by Synopsys, focused on Automotive, Design / EDA, Verification.
Conference organized by IEEE Circuits and Systems Society, focused on Analog, MEMS / Sensors, Design / EDA.
Forum organized by AMD, focused on AI / HPC, Automotive, Design / EDA.
Conference organized by Synopsys, focused on Design / EDA, Verification, Advanced Packaging.
Forum organized by Synopsys, focused on Automotive, Design / EDA, IP.
Conference organized by IEEE, focused on Test / Reliability, Design / EDA.
Conference organized by IFIP / IEEE / ACM SIGDA, focused on Design / EDA, AI / HPC, Embedded.
Conference organized by IEEE, focused on Wireless, Materials, Design / EDA.
Expo organized by Korea Semiconductor Industry Association, focused on Manufacturing, Materials, Equipment.
Conference organized by IEEE, focused on Advanced Packaging, Design / EDA.
Conference organized by NVIDIA, focused on AI / HPC, Automotive, Design / EDA.
Conference organized by IEEE / ACM, focused on AI / HPC, Design / EDA.
Conference organized by IEEE SSCS, focused on Design / EDA, AI / HPC, Memory.
Conference organized by IEEE CEDA, focused on Design / EDA, Test / Reliability, Verification.
Forum organized by Synopsys, focused on Design / EDA, IP, AI / HPC.
Conference organized by Siemens EDA, focused on Design / EDA, Advanced Packaging, Verification.
Forum organized by TSMC, focused on Design / EDA, Manufacturing, Advanced Packaging.
Conference organized by ACM / IEEE, focused on Design / EDA, AI / HPC.
Forum organized by TSMC, focused on Design / EDA, Manufacturing, Advanced Packaging.
Forum organized by TSMC, focused on Design / EDA, Manufacturing.
Training organized by Cadence, focused on Design / EDA, Automotive.
Conference organized by IEEE, focused on Manufacturing, Materials, Design / EDA.
Forum organized by TSMC, focused on Design / EDA, Automotive, Advanced Packaging.
Conference organized by IEEE Computer Society, focused on Test / Reliability, Verification, Hardware Security.
Conference organized by IEEE, focused on Design / EDA, Manufacturing, AI / HPC.
Conference organized by IEEE Electronics Packaging Society, focused on Advanced Packaging, Design / EDA, Test / Reliability.
Conference organized by IEEE CEDA, focused on Design / EDA, Manufacturing, Materials.
Conference organized by The Institute of Electronics and Information Engineers, focused on Design / EDA, AI / HPC, Wireless.
Conference organized by ACM / IEEE, focused on Design / EDA, AI / HPC, Memory.
Conference organized by Informa, focused on Design / EDA, AI / HPC.
Conference organized by IEEE Solid-State Circuits Society, focused on Design / EDA, AI / HPC, Memory.
Conference organized by Accellera Systems Initiative, focused on Verification, Design / EDA, Hardware Security.
Conference organized by ACM SIGDA, focused on Design / EDA, AI / HPC, Embedded.
Conference organized by IEEE Computer Society, focused on AI / HPC, Design / EDA, Memory.
Conference organized by DATE, focused on Design / EDA, Automotive, Hardware Security.
Conference organized by Chiplet Summit, focused on Advanced Packaging, Design / EDA, AI / HPC.
Conference organized by ACM SIGDA / IEEE CEDA, focused on Design / EDA, AI / HPC, Advanced Packaging.
Conference organized by ICMTS Organizing Committee / IEEE Electron Devices Society, focused on Test / Reliability, Manufacturing, Materials.
Conference organized by ACM ASPLOS, focused on AI / HPC, Design / EDA, Memory.
Conference organized by IEEE Latin-American Test Symposium, focused on Test / Reliability, Verification, Hardware Security.
Conference organized by IEEE Solid-State Circuits Society, focused on Design / EDA, IP, AI / HPC.
Conference organized by IEEE HOST Organizing Committee, focused on Hardware Security, Verification, Design / EDA.
Conference organized by IEEE Microwave Theory and Technology Society, focused on Wireless, Design / EDA, Photonics.
Conference organized by IEEE Microwave Theory and Technology Society, focused on Wireless, Photonics, Test / Reliability.
Conference organized by IEEE Microwave Theory and Technology Society, focused on Wireless, Design / EDA, Test / Reliability.
Conference organized by IEEE Microwave Theory and Technology Society, focused on Wireless, Manufacturing, Materials.
Conference organized by IEEE Circuits and Systems Society, focused on Design / EDA, AI / HPC, Wireless.
Conference organized by IEEE / Japan Society of Applied Physics, focused on Manufacturing, Design / EDA, AI / HPC.
Conference organized by IEEE Circuits and Systems Society, focused on Design / EDA, Analog, AI / HPC.
Conference organized by ACM / IEEE, focused on Design / EDA, AI / HPC, Verification.
Conference organized by IEEE, focused on Design / EDA, Manufacturing, AI / HPC.
Conference organized by IEEE Circuits and Systems Society, focused on Analog, MEMS / Sensors, Design / EDA.
Conference organized by IEEE Electron Devices Society, focused on Wireless, Materials, Manufacturing.
Past events
An archive for comparing previous editions
Conference organized by Cadence, focused on Design / EDA, AI / HPC.
Conference organized by Open Compute Project, focused on AI / HPC, Design / EDA, Power.
Training organized by Texas Instruments, focused on Power, Materials, Design / EDA.
Conference organized by Synopsys, focused on Design / EDA, AI / HPC, Advanced Packaging.
Conference organized by ACM SIGDA / IEEE CEDA, focused on Power, Design / EDA, AI / HPC.
Conference organized by ACM / IEEE, focused on Design / EDA, AI / HPC, Verification.
Conference organized by Cadence, focused on Design / EDA, AI / HPC, Verification.
Forum organized by Samsung Foundry, focused on Manufacturing, Design / EDA, IP.
Conference organized by ACM SIGARCH / IEEE Computer Society, focused on AI / HPC, Memory, Design / EDA.
Conference organized by ACM SIGDA, focused on Design / EDA, AI / HPC, Hardware Security.
Conference organized by SEMI Europe, focused on Advanced Packaging, Manufacturing, Materials.
Conference organized by IEEE / Japan Society of Applied Physics, focused on Manufacturing, Design / EDA, AI / HPC.
Conference organized by Apple, focused on Edge AI, Embedded, AI / HPC.
Conference organized by IEEE Microwave Theory and Technology Society, focused on Wireless, Design / EDA, Photonics.
Conference organized by IEEE Microwave Theory and Technology Society, focused on Wireless, Photonics, Test / Reliability.
Forum organized by Samsung Foundry, focused on Manufacturing, Design / EDA, IP.
Conference organized by IEEE Circuits and Systems Society, focused on Design / EDA, AI / HPC, Wireless.
Conference organized by Google, focused on AI / HPC, Edge AI, Embedded.
Conference organized by Siemens EDA, focused on Design / EDA, AI / HPC, Verification.
Conference organized by Siemens EDA, focused on Design / EDA, Advanced Packaging, Verification.
Conference organized by IEEE Test Technology Technical Council, focused on Test / Reliability, Hardware Security, Advanced Packaging.
Conference organized by European Design and Automation Association, focused on Design / EDA, Verification, Test / Reliability.
Conference organized by IEEE Solid-State Circuits Society, focused on Design / EDA, IP, AI / HPC.
Forum organized by Arm, focused on AI / HPC, Automotive, Design / EDA.
Conference organized by NVIDIA, focused on AI / HPC, Design / EDA, Advanced Packaging.
Conference organized by ACM SIGDA / IEEE CEDA, focused on Design / EDA, AI / HPC, Advanced Packaging.
Conference organized by Synopsys, focused on Design / EDA, Verification, Advanced Packaging.
Expo organized by NürnbergMesse, focused on Embedded, Edge AI, Automotive.
Conference organized by Chiplet Summit, focused on Advanced Packaging, Design / EDA, AI / HPC.
Conference organized by IEEE Solid-State Circuits Society, focused on Design / EDA, AI / HPC, Memory.
Conference organized by IEEE Computer Society, focused on AI / HPC, Design / EDA, Memory.
Semiconductor insight beyond the event dates
Read industry news, technical analysis and ecosystem shifts at VLSI Korea.